JPH087639Y2 - 半導体モジュール - Google Patents
半導体モジュールInfo
- Publication number
- JPH087639Y2 JPH087639Y2 JP5507890U JP5507890U JPH087639Y2 JP H087639 Y2 JPH087639 Y2 JP H087639Y2 JP 5507890 U JP5507890 U JP 5507890U JP 5507890 U JP5507890 U JP 5507890U JP H087639 Y2 JPH087639 Y2 JP H087639Y2
- Authority
- JP
- Japan
- Prior art keywords
- frame body
- screw hole
- semiconductor module
- screw
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 30
- 239000000463 material Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 16
- 239000010949 copper Substances 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000005336 cracking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5507890U JPH087639Y2 (ja) | 1990-05-25 | 1990-05-25 | 半導体モジュール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5507890U JPH087639Y2 (ja) | 1990-05-25 | 1990-05-25 | 半導体モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0415244U JPH0415244U (en]) | 1992-02-06 |
| JPH087639Y2 true JPH087639Y2 (ja) | 1996-03-04 |
Family
ID=31577711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5507890U Expired - Lifetime JPH087639Y2 (ja) | 1990-05-25 | 1990-05-25 | 半導体モジュール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087639Y2 (en]) |
-
1990
- 1990-05-25 JP JP5507890U patent/JPH087639Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0415244U (en]) | 1992-02-06 |
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